Electrolytic Nickel Plating Services
Mid-Atlantic Finishing Corp offers functional and engineered electrolytic nickel plating services to the aerospace, telecommunications, defense and medical sectors that is compliant to QQ-N-290, ASTM B689, AMS-2403 & AMS 2423 specifications.
Electrolytic nickel plating offers a number of features when applied to a substrate. One of those features is corrosion resistance. Electrolytic nickel is especially good for this due to a protective oxide surface that forms during the process. The degree to which the corrosion existence performs is dependent on the thickness of the application.
Other benefits of electrolytic nickel plating is that nickel deposits are slow to react in standard atmospheric environments. Electrolytic nickel also has an extremely high melting point making it an excellent coating for high-temp applications.
This metal also has a low coefficient of thermal expansion and is magnetic.
All steel parts having a hardness of RC-40 or greater require a post bake at 375 degrees + 25 degrees F for 3 hours.
MAF has the ability to underplate other underplates such as copper plating if required. You may specify an under plate to enhance adhesion and corrosion resistance of the nickel final deposit.
Electrolytic Nickel Plating Services to the following specifications:
|Class 1 -||Corrosion Protective Plating|
|Class 2 -||Engineering Plating|
|Table 1 Lists the Following Minimum Thicknesses:|
|Grade A:||0.0016 Min Thickness Plating|
|Grade B:||0.0012 Min Thickness Plating|
|Grade C:||0.0010 Min Thickness Plating|
|Grade D:||0.0008 Min Thickness Plating|
|Grade E:||0.0006 Min Thickness Plating|
|Grade F:||0.0004 Min Thickness Plating|
|Grade G:||0.0002 Min Thickness Plating|
|QQ-N-290 Class 1 Categories:|
|SB – Single Layer Bright Nickel Deposits
SD – Single Layer Dull or Semi-Bright (Satin) Deposits
M – Multilayer Nickel Deposits
|Underplating: When specified in the contract, purchase order or applicable drawing, Class 1 plating shall be applied over a plating of copper on steels, copper and copper based alloys. Class 1 plating shall be applied over an underplating of copper or yellow brass on zinc and zinc based alloys. In no case shall the copper underplate be substituted for any part of the specified nickel thickness.|
|Thickness of Plating|
|Class 1 – Unless otherwise specified, the minimum thickness of Class 1 nickel plating shall be as specified on any visible surfaces, which can be touched by a ball 0.75 inch in diameter.
Unless otherwise specified, the minimum nickel plating for ferrous materials or for zinc based alloys shall be Grade C. Unless otherwise specified, the minimum nickel plating for copper and copper alloys shall be Grade D. If the maximum thickness for Grade A is not specified in the contract, order or applicable drawing, the thickness shall not exceed 0.002 inch on all visible surfaces which can be touched by the 0.75 inch diameter ball.
|Type 1 -||Nickel Deposits Plated from Solutions Free of Brighteners Hardeners or Stress Control Additives|
|Type 2 -||Nickel Deposits Plated from Solutions Containing Sulfur or Other Co-deposited Additives|
|Type 3 -||Nickel Deposits Containing Dispersed Submicron Particles such as Silicon Carbide, Tungsten Carbide or Aluminum Oxide to Increase Hardness or Wear Resistance|
|Classes –||Class indicates minimum deposit thickness in microns (µm). e.g. Class 5 is a deposit of 5µm minimum thickness.|